340 Raleigh Street Holly Springs, NC 27540 919-552-3434 Phone 919-552-2772 Fax ctisales@smt-network.com
MODEL 9000-1

BGA Solder Sphere Placement System

Contact us NOW for your demonstration!

BGA Solder Sphere Placement System

• The Model 9000 operates using a self contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array.
• Alignment is achieved through precision pins and specific tooling for ease of use, repeatability, and accuracy in sphere placement
• "Black Contrast" for easy visual inspection or arrays.
• Repeatable process control to insure coplanarity and uniformity.
• Fits virtually all BGA layouts and sphere sizes
• Self-contained system, no additional air / vacuum required.
• Ideal for Lower Volume Manufacturers, Rework, and Prototyping

  PROCESS

• Place component in alignment plate
• Turn vacuum on
• Remove residual solder and/or contaminates
• Print flux on the component using appropriate stencil
• Load wand with sphere's using vacuum pick-up
• Align Wand using tooling pins
• Depress footpedal to release the full array of sphere's
• Lift block
• Remove component from carrier
• Reflow the part using proper profile

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Additional KIT setups

• Single or multiple component capabilities
• Custom tooling available
• Complete set-up achieved in seconds
• Very low operator training necessary
• Send your drawing or a sample HEPCO

  Features of the system are included in several Patent Pendings and Trademarks

Circuit Technology, Inc.
340 Raleigh Street
Holly Springs, NC 27540
Phone: 919 552-3434
Fax: 919 552 2772