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This is a three-day course designed to refine the student’s skills in the installation and removal of complex surface mount assemblies. Students will be introduced to the PACE TF-1700/IR3000 Surface Mount Rework system then will experiment with attaching thermocouples to devices and boards to capture a real-time image of their thermal characteristics and use that information to create the correct profile for removals and replacements. The student will also use an X-Ray inspection system and a look under microscope to inspect and characterize defects associated with leadless devices.
Day One
Lecture: (approx. 4 hours)
Basics of soldering discussion-Composition of solder
Eutectic vs. non-eutectic
Flux and its role in the soldering operation
Formation of intermetallics
Cleaning operations concerning leadless devices
Introduction to BGA’s
Common packages (PBGA/CBGA/CCGA/CSP/µBGA)
Developing the Rework Process Profiling
Attachment of thermo-couples
Reflow Parameters
Site Preparation
Basic Installations and Removals
Nozzle Features and Selection
Inspection Techniques
Reballing Techniques
Remainder of day concentrates on familiarization with machine, machine controls, machine calibration and preventive maintenance.
Day Two
Students will attach thermo-couples and develop time/temperature profiles for various devices.
Students will install various BGA, CSP, and µBGA packages using the profiles developed earlier.
Students will utilize X-Ray techniques to characterize various defects associated with leadless devices.
Day Three
Students will remove selected components using profiles developed earlier.
Students will learn various methods of preparing sites for reinstallation of devices.
Students will be introduced to reballing techniques and develop profiles accordingly.
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