Rework is defined as the act of reprocessing non-complying articles, through the use of original or equivalent processing, in a manner that assures full compliance of the article with applicable drawings or specifications. Probably 90% of the post assembly soldering processes fall into this category.

Repair is defined as the act of restoring the functional capability of a defective article in a manner that precludes compliance of the article with applicable drawings or specifications. These procedures include the repair of damaged laminate material caused by thermal excursions, replacement of damaged SMT pads or traces, replacement of damaged PTH barrels, etc.

Modification is defined as the revision of the functional capability of a product in order to satisfy new acceptance criteria. These are generally a result of engineering change orders and include the installation of jumper wires and other related procedures.

The course is modularized at the specialist level into sessions, the first of which is entitled Common Procedures. All 7711/21 certification candidates must attend this session and pass an end of session written test (multiple choice) of 20 questions. The candidate must achieve a score of 70% or better to advance to the other modules. The session is entitled common procedures because these basic issues are common to the IPC 7711 and 7721.

The common procedures module includes information on:

• Scope and Purpose or the standards
• Explanation of the standard layout
• Definitions of terms used in the standard
• Basic considerations for any soldering process
• Process goals and guidelines
• Discussion of primary heating methods
• Use of preheating and auxiliary heating methods
• Vision System considerations (microscope basics)
• Selecting the appropriate rework/repair/modification procedures
• Basics of a time/temperature profile
• Handling Electronic Assemblies
• Electrostatic discharge and electrical overstress
• ESD protective materials 
• ESD workstations
• Discussion on cleaning assemblies
• Need for baking and preheating PCB’s

After the candidate has successfully passed the Common Procedures module any of the remaining 8 modules may be taught in any order. The successful student will be issued an official IPC certification on the completed modules good for two years from the date of completion. Details on individual modules follow:



In this module the student will be introduced to various methods used to perform repair on PCB’s including replacement of damaged PTH barrels via the use of replacement eyelets and fullelets, replacement of damaged surface mount pads, replacement of damaged circuits (traces), and installation of jumper wires on PCB’s. The student will be introduced to ‘thermo-bond’ (dry-film adhesive backed pads/circuits) technology.

Module Eight – Laminate Repair

This module covers the repair of damaged laminate material. Students will repair a burn on a PCB by excavating the damaged material, mixing two-part epoxy, using the epoxy to fill the damaged area, and the use of coloring agents to match the PCB color. Other repair techniques will also be discussed such as tooling hole repair, repair of broken corners, etc. 

Module Nine – Conformal Coating Identification, Removal, and Replacement

This module takes the students though the conformal coating identification process using a truth table and the various characteristics of different coating types. Students are also exposed to various methods or removing conformal coatings (solvents, grinding, scraping, thermal, etc.), methods to protect adjacent components, and methods to recoat assemblies. The student will also be introduced to various equipment micro-milling and drilling equipment.

Please note:  There are 3 other modules that are part of the entire 7711/7721 program that are not covered in this particular version.  We can customize and add or subtract modules for onsite training sessions.  If you need a module that is not covered in one of our standard programs please call or email so we can discuss the options.