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jstd-001 ipc soldering standard


Includes a copy of
the standard

See Schedule for times and locations

  • Certified IPC Trainer = CIT
  • Certified IPC Specialist = CIS
  • Master IPC Trainer = MIT

IPC JSTD-001 CIS Certification
Certified IPC Specialist
Optional Space Addendum
now Available

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This is a comprehensive, hands-on solder training program based on J-STD-001. The program describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry consensus requirements for a broad range of electronic products.  Quick explanation of the JSTD documents.

The operator proficiency program consists of five modules detailed below. Candidates must successfully complete module one and then can take any other module/modules consistent with their job requirements.

Module One – General Requirements
This module is an introduction and overview to the entire contents of J-STD-001 Rev. D. and is a prerequisite to any of the following four technical specific modules. Module 1 consists of lecture, review, and an open and closed book written exam.

Module Two – Wires and Terminals
This module provides requirements for wire and terminal applications consisting of lecture, review, and instructor demonstrations. The students will prepare and solder wires to turret, bifurcated, J-hook, pierced, and cup terminals. Students must demonstrate proficiency in preparing and soldering wires to the above terminal types and pass the open book exam. 

Module Three – Pin-Through-Hole Technology
This module provides requirements for though-hole technology consisting of lecture, review, and instructor demonstrations. Students must prepare and solder through hole components to a printed circuit board. Components include a variety of axial and radial leaded devices. Students must also remove components from a PCB in a non-destructive manner. Students must demonstrate proficiency in the above and also pass the end open book exam.

Module Four – Surface Mount Technology
This module provides requirements for surface mount technology consisting of lecture, review, and instructor demonstrations. Components types include 1206 through 0402 chips, SOIC’s, PLCC’s, SOT’s, QFP’s, TSOP’s, etc. The students must demonstrate proficiency in various types of installations (convective and conductive) and removals and pass an open book examination.

Module Five – Inspection Methodology
This module provides requirements for inspection methodology and a basic introduction to process control issues. Through lecture and actual inspections of a sample PCB the student will demonstrate their proficiency in identifying acceptable and defective conditions according to the Standard. An open book examination is also required.

OPTIONAL Space Addendum Module
J-STD-001DS space addendum includes additional requirements over those published in J-STD-001D. The space community felt the base document does not adequately cover requirements that will help hardware survive the rigorous thermal cycles and intense vibration the hardware will be exposed to during acceptance and/or qualification testing, as well as during launch and mission life. There are also materials issues for hardware that will be in a micro-atmosphere (vacuum) environment. Although these are largely the responsibility of the design activity, some requirements in J-STD-001DS space addendum are intended to provide default materials requirements, or to at least initiate a discussion between manufacturing and the design activity.

All written exam grades for Modules completed will be averaged together. The minimum score for successful completion is 70%. The minimum score for each lab session is also 70%.

Upon successful completion of the course students will receive an IPC J-STD-001 Certified IPC Specialist certification good for two years.

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